Dr. Erik Novak, 4D Technology’s Director of New Business Development, will be presenting a paper entitled, “In-line High Resolution 3D Surface Measurements for Substrate Characterization” at the FLEX2016 Europe conference. Dr. Novak’s talk will be given on Wednesday, October 26, 12:05pm, as part of Session 6 (Flexible Hybrid Electronics Manufacturing: Challenges and Solutions).
FLEX2016 Europe will take place along with SemiCon Europa, Oct. 25-26 in Grenoble, France.
Click here for more information on the conference.
The abstract for Dr. Novak’s paper is given below:
As more flexible electronics products enter large-scale production, focus is increasingly moving from simply demonstrating technological capability towards higher yields, longer lifetimes, and superior performance. To improve profitability and market size of offerings, critical features that can affect performance must be monitored, including surface roughness, defect density, defect size and slope. Ideally, in situ metrology can be employed in roll-to-roll equipment to allow real-time process control of these key parameters. Barrier film permeability, circuit performance, and overall yield may all be better controlled via real-time measurements from within the roll-to-roll processing equipment.
This paper will present a compact, low-cost, large-field 3D metrology module for in situ measurements of flexible electronic substrates. The module is capable of sub-nanometer vertical resolution and micrometer-scale lateral resolution for accurate roughness and defect height determination. More than 17 cm^2 per minute of surfaces can be measured with 2 um lateral resolution. Modules are very compact, slightly larger than a mobile phone, and can be arrayed to provide scalable areal coverage based on each customer’s specific needs. Modules are vacuum compatible, vibration-immune, and are unaffected by the film backside or roller characteristics and thus ideal for placement within coating machines. While primarily designed for metrology of flexible electronics substrates, particularly barrier films, this metrology system also can perform high-speed 3D characterization of glass panels, semiconductor wafers and other smooth surfaces.
A variety of samples measured using these metrology modules, and these results were correlated with other precision measurement techniques. Flexible substrates will be measured on a roller in a roll-to-roll systems. Additional flat samples will be shown as measured with the metrology modules mounted over an XY stage.