520-294-5600 4dinfo@nanometrics.com

MEMS

Micro-Electro-Mechanical Systems

MEMS (Micro-Electro-Mechanical Systems) consist of miniaturized mechanical and electro-mechanical elements which are manufactured using various deposition and etching techniques.  MEMS devices range in size from sub-micron to several millimeters and vary from relatively simple structures having no moving elements, to complex systems with many moving elements. These systems are interchangeably referred to as MEMS, microsystems or micromachined devices.

One of the primary family of MEMS structures are microsensors, which convert mechanical signals into electrical outputs. These miniature transducers measure temperature, acceleration, pressure, force, rotational velocity, humidity, sound, magnetic fields and other parameters.

4D dynamic interferometers measure flatness and roughness of wafers.

NanoCam Sq optical profilers measure roughness on coated and uncoated wafers. NanoCam Sq can also measure the shape and shape change of wafer-level devices (such as microfluidics) and diced and packaged devices (such as micromirror arrays).

Added Technical Resources

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Measuring MEMS and other vertical roughness surfaces

A new technique provides a faster, more repeatable method for vibration-insensitive measurement in non-ideal environments.

Products for MEMS

AccuFiz

Fizeau laser interferometer for  fast, repeatable measurement of wafer flatness. 

Optical Profiling

NanoCam systems measure surface roughness on coated and uncoated wafers as well as measuring devices on patterned wafers. 

Get In Touch

(520) 294-5600

Location

3280 E Hemisphere Loop, Ste 146
Tucson, AZ 85706

Email

4Dinfo@nanometrics.com

Office Hours (Arizona Time)

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Wed: 8am - 5pm
Thur: 8am - 5pm
Fri: 8am - 5pm
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